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Tekt Industries

Specialisation · Design · Manufacture · Lifecycle

Advanced PCB Design

The board is the product. Our senior electronics engineers deliver high-density, high-speed and RF layouts that pass compliance first time and yield on the line.

Discuss a PCB project

Why Tekt

Layouts engineered for physics, compliance and yield

Great schematics die in bad layout. Our PCB practice pairs simulation-driven signal and power integrity with the manufacturing knowledge of our own SMT line — every stack-up, via strategy and footprint decision is made knowing exactly how the board will be built and tested.

From high-density wearables to RF systems for Silentium Defence, our boards ship in medical, military and consumer products worldwide.

High-speed & HDI layoutRF & antenna integrationSignal & power integrity simulationEMC pre-compliance & DFMThermal design & stack-up engineering

How we deliver

Unique value, end to end

  • Simulation first

    SI/PI and thermal simulation before fabrication — problems found on screen, not on the bench.

  • Built where designed

    Layouts reviewed by the production engineers who will assemble them, on the line one floor down.

  • Compliance by design

    EMC and safety margins engineered in from the first placement, pre-scanned in-house.

Case studies

Case studies

Real programs from this practice — the brief, the engineering approach, and where it landed.

  • Case study 01 · Silentium Defence

    RF front-end for passive radar

    Passive radar lives or dies on noise floor. Our layouts for Silentium’s sensing platforms isolate sensitive RF chains from dense digital sections — qualified cleanly for defence deployment.

  • Case study 02 · THIM

    Wearable sleep-tracking hardware

    A finger-worn wearable leaves no room for error. We delivered the miniaturised, power-frugal board design behind THIM’s sleep tracker, balancing radio performance against weeks-scale battery life.

  • Case study 03 · Nano Components

    High-speed IR sensing array

    We re-engineered an existing IR solution into a new interference-based presence-sensing array — the analogue front end redesigned for high-speed detection at production-friendly cost.

What we solve

Problems this practice removes

  • Boards that pass the bench but fail EMC
  • Layouts that assemble poorly and yield worse
  • High-speed interfaces marginal at temperature
  • Re-spins driven by unobtainable parts

Tools, processes & standards

Altium Designer & managed ECAD librariesSI/PI simulationIPC-2221/2222 design standardsIPC-A-610 acceptance criteriaIn-house EMC pre-scanDFM/DFT review gates

Who delivers it

The team behind it

  • Senior PCB design engineer — 10+ years HDI and high-speed; medical and defence delivery
  • Signal integrity specialist — Simulation correlated against lab measurement
  • Production liaison engineer — Panelisation, test-point and yield ownership

Capabilities

HDI layoutRF & high-speedEMC by designDFM

FAQ

Frequently asked questions

Have a board that has to be right?

From first stack-up to first-pass compliance — we design boards that ship.

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